The solder joint reliability of ceramic chip resistors assembled to laminate substrates has been a long time concern for systems exposed to harsh environments. In this work, the thermal cycling reliability of several 2512 chip resistor lead‐free solder joint configurations has been investigated. In an initial study, a comparison has been made between the solder joint reliabilities obtained with components fabricated with both tin‐lead and pure tin solder terminations. In the main portion of the reliability testing, two temperature ranges (−40‐125°C and −40‐150°C) and five different solder alloys have been examined. The investigated solders include the normal eutectic Sn‐Ag‐Cu (SAC) alloy recommended by earlier studies (95.5Sn‐3.8Ag‐0.7Cu), and three variations of the lead‐free ternary SAC alloy that include small quaternary additions of bismuth and indium to enhance fatigue resistance.
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1 August 2004
Research Article|
August 01 2004
Thermal cycling reliability of lead‐free chip resistor solder joints
Jeffrey C. Suhling;
Jeffrey C. Suhling
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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H.S. Gale;
H.S. Gale
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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R. Wayne Johnson;
R. Wayne Johnson
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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M. Nokibul Islam;
M. Nokibul Islam
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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Tushar Shete;
Tushar Shete
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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Pradeep Lall;
Pradeep Lall
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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Michael J. Bozack;
Michael J. Bozack
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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John L. Evans;
John L. Evans
Center for Advanced Vehicle Electronics (CAVE), Auburn University, Alabania, USA
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Ping Seto;
Ping Seto
DaimlerChrysler‐Huntsville Electronics, Huntsville, Alabania, USA
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Tarun Gupta;
Tarun Gupta
DaimlerChrysler‐Huntsville Electronics, Huntsville, Alabania, USA
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James R. Thompson
James R. Thompson
DaimlerChrysler‐Huntsville Electronics, Huntsville, Alabania, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© Emerald Group Publishing Limited
2004
Soldering & Surface Mount Technology (2004) 16 (2): 77–87.
Citation
Suhling JC, Gale H, Wayne Johnson R, Nokibul Islam M, Shete T, Lall P, Bozack MJ, Evans JL, Seto P, Gupta T, Thompson JR (2004), "Thermal cycling reliability of lead‐free chip resistor solder joints". Soldering & Surface Mount Technology, Vol. 16 No. 2 pp. 77–87, doi: https://doi.org/10.1108/09540910410537354
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