To determine the endurance of stainless steels used for wave soldering container materials in molten lead‐free solders.
A dissolution test on stainless steel wires in molten lead‐free solders was performed. The effects of the composition of the stainless steel, test period, and composition of the lead‐free solder on the dissolution rate were investigated. Dissolution was measured by cross‐sectioning the wires and measuring the reduction in radius.
The Sn‐Ag lead‐free solder showed faster dissolution than did the conventional Sn‐Pb eutectic. A severe dissolution rate was also observed for the Sn‐Zn system.
Quantitative data for the reaction rate between stainless steels and molten lead‐free solder is useful for the design of soldering machines and in planning their maintainance.
This paper shows the effect of basic factors on the dissolution rate of stainless steels in molten solder. It can give a basic understanding to engineers of the effect of lead free solders on wave soldering process equipment.
