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Volume 2, Issue 3
1 March 1990
Soldering & Surface Mount Technology Cover Image for Volume 2, Issue 3
Review Article| March 01 1990

SMART group news Available to Purchase

Colin Lea;
Colin Lea
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C. O Mathuna
C. O Mathuna
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1990
Soldering & Surface Mount Technology (1990) 2 (3): 62–65.
https://doi.org/10.1108/eb037734

A large group of SMART Group members visited the Henley premises of Electrovert on 9 May. After the welcome and introduction where Mike Judd emphasised Electrovert's commitment to SMT, a number of papers were presented by the Electrovert team during the morning session.

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© MCB UP Limited
1990
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

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