The purpose of this paper is to study the effect of copper concentration in near‐eutectic liquid SAC solders on their thermophysical properties: viscosity, surface tension, density; as well as wetting behavior on copper substrates at 523 K.
Viscosity, surface tension, and density were studied over a broad range of temperatures with the recently developed Roach‐Henein method. The obtained results were compared with the data from modified capillary, maximum bubble pressure, wetting balance and dilatometric measurements. Wetting angles measured with wetting balance method were compared with the results of sessile drop measurements.
The results obtained indicate that increasing concentration of copper in the alloy results in higher density, surface tension and viscosity, but differences resulting from copper concentration on wettability are relatively small. At 523 K, the density is: 7.097, 7.186, 7.232 g cm−3, the surface tension is: 538.1, 553.5, 556.7 m Nm−1, the viscosity is: 2.173, 2.227, 2.467 mPas, respectively, for alloys containing 0.41, 1.01 and 1.61 wt% of Cu. Wetting angles on copper substrates are similar within a margin of error for all compositions. The results of present study are compared with the available literature data and a relatively good agreement is observed.
This paper provides the data of thermophysical properties of widely‐used SAC solders including viscosity, of which there is little data in the literature. It is confirmed that the increased copper concentration increases viscosity, yet this effect is small and does not correlate with the wetting behavior.
