Thermal cycling effect on the drop reliability of BGA lead-free solder joints Available to Purchase

Fang Liu received her MSc degree in Mechanics from Shanghai University, China, in 2004, and her PhD degree in Mechanical Engineering from Shanghai Jiao Tong University, China, in 2008. She has been engaged in solder joint reliability, vibration and shock analysis and control. She has published more than 20 papers in refereed journals and conferences. Fang Liu carried out post-doctoral research at the State Key Laboratory of Mechanical System and Vibration, Shanghai Jiao Tong University, Shanghai, China. She now works for Wuhan Textile University.

Jiacheng Zhou is a postgraduate student in the School of Mechanical Engineering and Automation at Wuhan Textile University, China. His research interests include PCB vibration and thermal analysis. He has published his earlier work in a referred journal.

Nu Yan is Professor in the Department of Mechanical Engineering at the Wuhan Textile University. His research interests cover the mechanical properties of materials and structures, involving the very high cycle fatigue properties of metal alloys, the reliability of steel structures and surface modification.