This paper aims to present a review of the recent developments in vapour phase soldering (VPS) technology. This study focuses on the following topics: recent developments of the technology, i.e. soft and vacuum VPS; measurement and characterization methods of vapour space, i.e. temperature and pressure; numerical simulation of the VPS soldering process, i.e. condensate layer and solder joint formation; and quality and reliability studies of the solder joints prepared by VPS, i.e. void content and microstructure of the solder joints.
This study was written according to the results of a wide literature review about the substantial previous works in the past decade and according to the authors’ own results.
Up to now, a part of the electronics industry believes that the reflow soldering with VPS method is a significant alternative of convection and infrared technologies. The summarized results of the field in this study support this idea.
This literature review provides engineers and researchers with understanding of the limitations and application possibilities of the VPS technology and the current challenges in soldering technology.
This paper summarizes the most important advantages and disadvantages of VPS technology compared to the other reflow soldering methods, as well as points out the necessary further developments and possible research directions.
