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Volume 4, Issue 2
1 February 1992
Soldering & Surface Mount Technology Cover Image for Volume 4, Issue 2
Review Article| February 01 1992

Industry news Available to Purchase

Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1992
Soldering & Surface Mount Technology (1992) 4 (2): 50–52.
https://doi.org/10.1108/eb037794

Chicago Laser Systems (CLS) have moved to new headquarters in Des Plaines, a suburb of Chicago, near O'Hare International Airport. The new facility, comprising 52,000ft2, embodies plant and administrative functions, and has space for further growth.

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© MCB UP Limited
1992
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Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

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