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Electronic materials, particularly tin‐lead coated component leads, may degrade and acquire a poor solderability as a result of long‐term storage or prolonged periods at elevated temperatures (during burn‐in). This paper presents the results of studies on the surface chemistry and microstructure of such coatings together with a technique for stripping degraded coatings and replacing them with pristine finishes having excellent solderability.
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© MCB UP Limited
1992
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