Skip to Main Content
Article navigation
Volume 5, Issue 3
1 March 1993
Soldering & Surface Mount Technology Cover Image for Volume 5, Issue 3
Review Article| March 01 1993

The Influence of Metal Plating of Chip Carriers on Reliability of SMT Solder Joints under Thermal Cycling Available to Purchase

J.H. Huang;
J.H. Huang
Department of Materials Science and Engineering, University of Science and Technology, Beijing, PRC
Search for other works by this author on:
This Site
PubMed
Google Scholar
H.Z. Li
H.Z. Li
Ministry of Aero‐Space Industry of the People's Republic of China, Beijing, PRC
Search for other works by this author on:
This Site
PubMed
Google Scholar
Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1993
Soldering & Surface Mount Technology (1993) 5 (3): 18–20.
https://doi.org/10.1108/eb037836

An experimental set‐up and a simulated ceramic chip carrier to study SMT solder joint reliability under thermal cycling have been developed. The influence of metal plating of the chip carrier on the reliability of the SMT solder joints under thermal cycling has been studied statistically.

This content is only available via PDF.
© MCB UP Limited
1993
You do not currently have access to this content.
Don't already have an account? Register

Purchased this content as a guest? Enter your email address to restore access.

Please enter valid email address.
Email address must be 94 characters or fewer.
Pay-Per-View Access
$41.00
Rental
This article is also available for rental through DeepDyve. Read this now at DeepDyve
94 Views
View Metrics
Study on process optimization and suppression methods for wafer-level electroplated copper nodule defects
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation

Suggested Reading

The Manufacture and Reliability of the EPIC Chip Carrier
Circuit World (March,1984)
The Chip Carrier, Universal Chip Support for High Level Integration
Hybrid Circuits (January,1982)
Mounting Leadless Chip Carriers onto Printed Circuit Boards
Hybrid Circuits (January,1982)
Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip Carriers
Circuit World (April,1982)
A Study of the Failure of Soldered SMT Joints during Thermal Cycling
Soldering & Surface Mount Technology (February,1992)

Related Chapters

The development of the bulk carrier
Tanker and Bulk Carrier Terminals
Benchmarking US All-Cargo Carriers: A Productivity and Cost Competitiveness Analysis
Airline Efficiency
Overview of Low-Cost Carriers in Russia and Post-Soviet States
Airlines and Developing Countries

Recommended for you

These recommendations are informed by your reading behaviors and indicated interests.

Cited By

Google Scholar
This Feature Is Available To Subscribers Only

or Create an Account

Close Modal
Close Modal