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Volume 5, Issue 3
1 March 1993
Soldering & Surface Mount Technology Cover Image for Volume 5, Issue 3
Review Article| March 01 1993

SM Placement Technology: Part 2 Available to Purchase

H. Pawlischek
H. Pawlischek
Siemens, Munich, Germany
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1993
Soldering & Surface Mount Technology (1993) 5 (3): 53–58.
https://doi.org/10.1108/eb037841

This paper, which will be published in two parts in consecutive issues of Soldering & Surface Mount Technology, reproduces a chapter of the recently published book ‘Handbook of Printed Circuit Technology: New Processes, New Technologies’, edited by G. Herrmann and K. Egerer and published by Electrochemical Publications Ltd, Port Erin, Isle of Man.

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© MCB UP Limited
1993
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