The reliability of 0.4 mm pitch, 28 mm body size, 256‐pin plastic quad flat pack (QFP) no‐clean and water‐clean solder joints has been studied by temperature cycling and analytical analysis. The temperature cycling test was run non‐stop for more than 6 months, and the results have been presented as a Weibull distribution. A unique temperature cycling profile has been developed based on the calculated lead stiffness, elastic and creep strains in the solder joint, and solder data. Also, the thermal fatigue life of the solder joints has been estimated and correlated with experimental results. Furthermore, a failure analysis of the solder joints has been performed using scanning electron microscopy (SEM). Finally, a quantitative comparison between the no‐clean and water‐clean QFP solder joints has been presented.
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1 January 1994
Review Article|
January 01 1994
Reliability of 0.4 mm Pitch, 256‐pin Plastic Quad Flat Pack No‐clean and Water‐clean Solder Joints
J. Lau;
J. Lau
Hewlett‐Packard Company, Palo Alto, California, USA
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Y.‐H. Pao;
Y.‐H. Pao
Ford Motor Company, Dearborn, Michigan, USA
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C. Larner;
C. Larner
Ford Motor Company, Dearborn, Michigan, USA
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R. Govila;
R. Govila
Ford Motor Company, Dearborn, Michigan, USA
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S. Twerefour;
S. Twerefour
Ford Microelectronics, Inc., Colorado Spring, Colorado, USA
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D. Gilbert;
D. Gilbert
Ford Microelectronics, Inc., Colorado Spring, Colorado, USA
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S. Erasmus;
S. Erasmus
Hewlett‐Packard Company, Palo Alto, California, USA
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S. Dolot
S. Dolot
Ford Motor Company, Dearborn, Michigan, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1994
Soldering & Surface Mount Technology (1994) 6 (1): 42–50.
Citation
Lau J, Pao Y, Larner C, Govila R, Twerefour S, Gilbert D, Erasmus S, Dolot S (1994), "Reliability of 0.4 mm Pitch, 256‐pin Plastic Quad Flat Pack No‐clean and Water‐clean Solder Joints". Soldering & Surface Mount Technology, Vol. 6 No. 1 pp. 42–50, doi: https://doi.org/10.1108/eb037854
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