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The SMART Group has been investigating joining methods for ball grid arrays (BGAs). Originally a development of IBM, and expected to be a dominant packaging technology, the BGA is best visualised as a legless PGA. It has the same advantages—high lead count, wide pitch, small area—but does not need holes. The problem of the BGA is that the interconnects are not visible. This places a high demand on process control and material selection — it really is a case of ‘right first time’. The investigation concentrated on this aspect.
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