Stencil cleaning has become both more difficult and more critical for modern surface mount technology. There is an increasing need for cleaning agents for stencils which are effective, safe for workers and safe for the environment. This paper describes a new laboratory test which was developed for predicting the performance of stencil cleaning formulations. A new aqueous, inorganic based cleaning agent has been developed which gives cleaning performance which was overall better than that of IPA. Testing was performed over a range of solder pastes. This performance advantage was confirmed with commercial stencil cleaning equipment. In addition to being very effective, this inorganic based stencil cleaner offers significant environmental and worker safety advantages.
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1 March 1995
Review Article|
March 01 1995
Stencil Cleaning: An Area of Increasing Importance
F. Cala;
F. Cala
Church & Dwight Co., Inc., Princeton, New Jersey, USA
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R. Reynolds
R. Reynolds
Church & Dwight Co., Inc., Princeton, New Jersey, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1995
Soldering & Surface Mount Technology (1995) 7 (3): 17–19.
Citation
Cala F, Reynolds R (1995), "Stencil Cleaning: An Area of Increasing Importance". Soldering & Surface Mount Technology, Vol. 7 No. 3 pp. 17–19, doi: https://doi.org/10.1108/eb037907
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