The electronics industry seems to be under slightly less pressure, at present, to move to lead‐free solders. Nevertheless, many companies are interested in switching to comply with initiatives aimed at reducing the use of toxic materials such as lead. At the same time, these and other companies are hoping to use the improved properties of many lead‐free solders to increase solder joint reliability. While lead‐free solders can indeed give improved properties in the proper system, using them with lead‐containing materials can actually give poorer properties and uncertain reliability. It is important to understand these materials' interactions as thoroughly as possible before introducing new solder compositions. To illustrate this point, some case histories will be presented, along with a general discussion of how solders and substrates can and do interact.
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1 June 1997
Research Article|
June 01 1997
Some Problems in Switching to Lead‐free Solders*
W.B. Hampshire
W.B. Hampshire
Hampshire Technical Services, Columbus, Ohio, USA
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Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1997
Soldering & Surface Mount Technology (1997) 9 (1): 11–12.
Citation
Hampshire W (1997), "Some Problems in Switching to Lead‐free Solders*". Soldering & Surface Mount Technology, Vol. 9 No. 1 pp. 11–12, doi: https://doi.org/10.1108/09540919710777761
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