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Volume 9, Issue 2
1 December 1997
Soldering & Surface Mount Technology Cover Image for Volume 9, Issue 2
Research Article| December 01 1997

The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies

J.H. Lau
Express Packaging Systems, Inc., Palo Alto, California, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1997
Soldering & Surface Mount Technology (1997) 9 (2): 58–60.
https://doi.org/10.1108/09540919710800674

The objective of this paper is to point out the limitations and ròles of DNP (distance to neutral point) on predicting the solder‐joint thermal‐fatigue life of area‐array assemblies.

Keywords: Solder joint, Reliability, Ball grid array, DNP
© MCB UP Limited
1997
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