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Volume 9, Issue 2
1 December 1997
Soldering & Surface Mount Technology Cover Image for Volume 9, Issue 2
Research Article| December 01 1997

The Roles of DNP (Distance to Neutral point) on Solder Joint Reliability of Area Array Assemblies Available to Purchase

J.H. Lau
J.H. Lau
Express Packaging Systems, Inc., Palo Alto, California, USA
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Author & Article Information
Publisher: Emerald Publishing
Online ISSN: 1758-6836
Print ISSN: 0954-0911
© MCB UP Limited
1997
Soldering & Surface Mount Technology (1997) 9 (2): 58–60.
https://doi.org/10.1108/09540919710800674

The objective of this paper is to point out the limitations and ròles of DNP (distance to neutral point) on predicting the solder‐joint thermal‐fatigue life of area‐array assemblies.

Keywords:
Solder joint, Reliability, Ball grid array, DNP
© MCB UP Limited
1997
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