This study aims to investigate the mechanical behavior and complex coupling effects of key components in transmitter–receiver (TR) modules with quasi-coaxial structures under high-impact loads, identifying stress distribution characteristics to facilitate high-reliability anti-impact design.
An integrated finite element mechanical model comprising the module housing, 0.6-mm inner-conductor quasi-coaxial structures, alumina substrates, chips and 25-µm gold bonding wires was established via ANSYS. A half-sine impact load (20,000 g acceleration, 10 ms pulse width) was applied. A rigorous mesh convergence analysis was performed to validate the numerical reliability in the absence of physical experimental data.
Results reveal a hierarchical stress gradient, diminishing from the top layer down to the interior components. The top solder ball section bore the maximum stress of 57 MPa. Quantitative analysis reveals that edge proximity significantly affects reliability: reducing the distance between the quasi-coaxial structure and the frame from 0.5 to 0.3 mm intensified local stress concentration, raising the peak frame stress from 16.53 to 19.23 MPa. Furthermore, low-arc-height bonding wires with platforms were identified as the optimal configuration for minimizing deformation.
The proposed optimization principles for key structures (via holes, bonding wires, quasi-coaxial structures, etc.) provide direct technical guidance for the anti-impact design of TR modules. They can be applied to radar, communication and other high-mobility electronic systems, effectively reducing failure risks (e.g. via cracking, chip detachment) under extreme conditions like missile launches, improving module reliability and engineering application efficiency.
Reliable TR modules are critical for high-performance electronic systems in national defense, aerospace and other fields. This study’s findings enhance the stability of equipment operating in harsh environments, support the development of high-mobility and anti-interference electronic technologies and indirectly contribute to national security, technological progress and the reliability of critical infrastructure.
This work fills a gap in the quantitative analysis of “deformation-stress” coupling mechanisms for quasi-coaxial TR modules under high-g environments. It provides critical, data-driven design guidelines, specifically advocating for optimized edge spacing and wire geometries to mitigate stiffness mismatch failures in severe mechanical shock applications.
