Dexter introduces a breakthrough high thermally conductive die attach adhesive

Dexter introduces a breakthrough high thermally conductive die attach adhesive

Keywords Adhesives, Dexter, Electronic packaging

Quantum Materials, a business unit of Dexter Electronic Materials, announced the introduction of its newest product in the QMI 500 Series of bismaleimide (BMI) based adhesives for non-hermetic packaging. The QMI 536HT is formulated using the patented liquid bismaleimide monomer and other resin additives, plus boron nitride filler to achieve thermal conductivity in excess of 0.7 W/(mK). This 100 percent solids adhesive can be quick oven cured at temperatures as low as 125°C. The QMI 536HT provides superior dispensability, cures to produce a defect-free layer that absorbs very little moisture, retains adhesion during JEDEC Level 1 exposure and has a dielectric constant of 3.5.

The adhesive is used in die attach applications where electrical insulation combined with superior thermal performance is required for laminate, ceramic and metal substrates.The low stress properties of QMI 536HT are ideal for heat sink and lid attach to flip chips, as well as traditional die attach applications.

For further information,please contact Dexter Corporation, Electronic Materials, 15051 East Don Julian Road Industry, CA 91746, USA. Tel: +1 626 968 6511; Fax: +1 626 336 0160.