Quad Systems announces improved APS-I repeatability specification Free

Quad Systems announces improved APS-I repeatability specification

Keywords Assembly, Flip chip, Placement,Quad Systems

Quad Systems Corporation has improved the placement process capability of its APS-1 Advanced Packaging System assembler. The new specification is ± 19 microns (±0.00075 inches) @ 3 sigma. This represents a substantial improvement in the ability of the APS-1 to place today's finest pitch flip chips. The APS-1 is used in manufacturing operations for precision attachment of die or flip chips to a substrate, in addition to complete SMT assembly.