IPC. IPC-7095 focuses on BGA reliability issues
IPC
IPC-7095 focuses on BGA reliability issues
Keywords: IPC, Reliability, BGA
PC have announced the release of IPC-7095, Design and Assembly Process Implementation for BGAs. This document describes the design and assembly challenges for implementing Ball Grid Array (BGA) and fine pitch BGA (FBGA)technology.
Managers, designers and process engineers, operators and technicians who deal with electronics assembly, inspection and repair processes can use this document for critical inspection, repair and reliability associated with BGAs.
The document also provides useful and practical information for those new to BGA implementation, including:
managing BGA implementation;
component considerations;
PCBs and other mounting structures;
printed circuit assembly design consideration;
assembly of BGAs on printed circuit boards;
reliability;
x-ray film images of voids, demonstrating the tonal accuracy of the film;
example of voided area at land and board interface;
criteria for acceptability of voids for the three classes of assembly.
According to IPC Director of Technology Transfer Dieter Bergman this document has mainstream technology trends in its crosshairs.
"This is the first time the industry has had a consensus document containing design and assembly issues associated with BGA implementation",says Bergman. "The technology detailed will dictate the future infrastructure of the industry".
The IPC-7095 document is available for purchase at the IPC Web site: www.ipc.org, or by calling 847 790 5362. The cost is $30 for IPC members and $60 for non-members.
