Metcal delivers enhanced version of BGA array package rework system
Metcal delivers enhanced version of BGA array package rework system
Keywords: Metcal, Ball grid array
Metcal have launched an enhanced version of their BGA rework system. This system is available in two models – the CSP-3500 designed for smaller chip scale rework, and the BGA-3590 with high-powered under-board heating for thermally demanding PCBs (Plate 4). Metcal's array package rework system has a range of enhancements designed to improve performance and simplify operator use.
Plate 4 Metcal's enhancement to their BGA rework system is available in two models:CSP-3500 for smaller chip scale rework, and the BGA-3590 has high-powered under-board heating for thermally demanding PCBs
Pivotal to the system enhancements is the addition of an imaging camera that provides sharpness and definition when working on fine pitch CSP components. The camera's ability to provide optimum clarity greatly improves the integral vision system that simplifies both the placement of components and stencil alignment. With the aid of a prism feature, users can simultaneously look at the topside of the PCB and a superimposed image of the component underside. The images can then be accurately aligned in the X, Y and Theta axis. In addition, the improved vision system includes facilities for either solder paste or flux application without the need to remove the PCB from the machine.
Other enhancements include simplified system controls, which are now accessible from the front of the machine, and improved board handling. The under-board support has been completely re-designed to ensure easy adjustment and firm support without the risk of damage to the PCB. Difficult shaped PCBs can also be supported with the two sizes of edge clamps now included.
Further information: www.metcal.com
