Vantage X-ray from Contax
Article Type: New products From: Soldering & Surface Mount Technology, Volume 21, Issue 3
Following the launch of the new Vantage Range in January, production automation system specialist Contax Ltd are pleased to introduce the EXR100T X-ray system that embodies the principals of the Vantage range with quality,functionality and outstanding value for money.
The EXR100T is a real time high resolution X-ray system designed and proven to address the inspection needs of BGA, CSP, flip chip and semi-conductor inspection applications. It uses the latest technology, the 100 kV X-ray tube,along with the high-resolution image intensifier and the EXR100T will inspect boards or products up to 400 × 400 mm. The EXR100T is highly flexible with movement in x-, y-, z-directions and also has tilt for angular views.
The whole inspection process is made simple and effective with easy touch screen controls for precise control of the X-ray parameters along with solid reliable engineering of all the axes. The standard software features and their capabilities further enhance the system with BGA void analysis, BGA ball measurement and even 3D rendering. The results can be logged for future analysis and images can be captured and stored as required. The entire system is housed in a fully contained safety cabinet which enables a fast, simple and efficient installation at customer sites (Figure 3).
“The Vantage EXR100T provides the cost-effective answer to X-ray solder joint inspection of electronic products” said Mike Rapson, Managing Director of Contax Ltd “The high quality image gives the operator the opportunity to quantify and monitor the quality of solder joints. It is an excellent addition to our Vantage Range offering customers value for money without compromising performance, capability or quality.”
