Low profile Molex ClipLok interconnect clip firmly secures circuit-to-board connections
Article Type: New products From: Soldering & Surface Mount Technology, Volume 24, Issue 2
Molex Incorporated introduces the ClipLok™ interconnect clip, an electromechanical connection that easily attaches to secure a membrane switch or FPC tail firmly to a printed circuit board, eliminating the need for mating connectors at each point. A first-to-market product, the low-profile ClipLok interconnect clip provides immediate and reliable circuit-to-board connectivity in a range of consumer, medical, networking and telecommunications applications.
The latest addition to the Molex line of integrated switch assemblies, the ClipLok interconnect clip offers a less bulky alternative to other circuit-to-board interconnect methods. The mechanical component securely bonds circuits together by means of a spring-type mechanism. Electrical connections are achieved when the switch circuits are wrapped around the edge of the board. Finally, a built-in feature on each ClipLok interconnect clip guides the assembler in the correct placement of the clip and circuit.
Molex’s ClipLok interconnect clip and membrane switch assemblies are qualified through tests based on American Society of Testing and Material (ASTM)standards. All Molex manufacturing facilities are ISO9000 and ISO14000 certified. For additional information about ClipLok interconnect clip features and applications, please visit Molex. To receive regular updates on other Molex products and industry solutions, please register with www.molex.com
