Enthone Appoints Dr Stream Chung Global Product Line Manager, WLP & TSV
Article Type: Appointments From: Soldering & Surface Mount Technology, Volume 25, Issue 2
Dr Stream Chung has been appointed Global Product Line Manager for wafer level packaging (WLP) and through-silicon via (TSV) processes by Enthone. Dr Chung is responsible for global marketing activities of the company’s MICROFAB®wafer bump packaging and TSV technologies.
Dr Chung joined Enthone in 2006 and is the founder of the Enthone Global Semiconductor Application Center (GSAC) in Taiwan. Over the past several years,the centre has created significant customer value and further solidified Enthone as a leading supplier to the semiconductor industry. Prior to this new position,Dr Chung was Asia Marketing Manager – WLP since 2010 during which time he was instrumental in transferring the voice of the customer into numerous projects. In addition, Dr Chung has been responsible for developing technology training programs that enable Enthone to bring a superior level of technical expertise to its customers and the industry.
Mr Mike Corey, Enthone Global Business Director – Electronic Materials,said, “With Stream’s extensive and sound experience in the semiconductor industry, along with his proven track record within Enthone, I am confident he will be very successful in his new global role”.
MICROFAB processes include copper pillar/post, copper RDL, nickel, tin bump,tin/tin-silver bump, gold bump, and TSV. All offer increased performance and enhanced cost-effectiveness while also meeting environmental, health and safety standards.
