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Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

Rafael Kakitani, Cassio Augusto Pinto da Silva, Bismarck Silva, Amauri Garcia, Noé Cheung, José Eduardo Spinelli

Soldering & Surface Mount Technology (2022) 34 (1): 24–30.

https://doi.org/10.1108/SSMT-01-2021-0003

Published: 24 June 2021

View article titled, Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys

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