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Journal Articles

Reliability analysis of a novel fan‐out type WLP

Ming‐Chih Yew, Mars Tsai, Dyi‐Chung Hu, Wen‐Kun Yang, Kuo‐Ning Chiang

Soldering & Surface Mount Technology (2009) 21 (3): 30–38.

https://doi.org/10.1108/09540910910970394

Published: 26 June 2009

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Journal Articles

A novel crack and delamination protection mechanism for a WLCSP using soft joint technology

Ming‐Chih Yew, Chien‐Chia Chiu, Shu‐Ming Chang, Kuo‐Ning Chiang

Soldering & Surface Mount Technology (2006) 18 (3): 3–13.

https://doi.org/10.1108/09540910610685385

Published: 01 July 2006

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