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Journal Articles

Effect of PCB surface finish on creep properties of lead‐free solder joints

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Janne J. Sundelin, Sami T. Nurmi, Toivo K. Lepistö, Eero O. Ristolainen
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (4): 3–9.
https://doi.org/10.1108/09540910510630377
Published: 01 December 2005
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Journal Articles

The effect of PCB surface finish on lead‐free solder joints

Available to Purchase
Sami T. Nurmi, Janne J. Sundelin, Eero O. Ristolainen, Toivo K. Lepistö
Journal: Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (1): 13–23.
https://doi.org/10.1108/09540910510579203
Published: 01 March 2005
View article titled, The effect of PCB surface finish on lead‐free solder joints
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