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Keywords: 01005
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (4): 235–243.
Published: 20 September 2011
...Yong‐Won Lee; Keun‐Soo Kim; Katsuaki Suganuma Purpose The purpose of this paper is to optimize assembly processes in order to minimize defects in the assembly of 01005 chip components. Design/methodology/approach During the study, solder paste printing process‐related variables, such as solder...
