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Keywords: 2.5D packaging
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (3): 205–222.
Published: 10 March 2025
...Jie Wu; Guangyao Chen; Shujia Fan; Ruiyang Pang; Yu Liang; Yi Teng Purpose This study aims to minimize the warpage issue in memory-computing integrated chiplets with 2.5D packaging on a large-scale wafer subjected to multistress through synergistic optimization of key structure paraeters...
