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Keywords: Accelerated testing
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (1): 30–37.
Published: 03 February 2012
... be monitored and analysed non‐destructively. Ryan S.H. Yang can be contacted at: s.h.yang@2005.ljmu.ac.uk © Emerald Group Publishing Limited 2012 Acoustic micro imaging Solder joint reliability Flip chip Through lifetime monitoring Accelerated testing Acoustic testing Imaging...
