...Ling Zou; Chris Hunt Purpose The purpose of this paper is to present a new test method (tape peel method) to evaluate conformal coating adhesion to electronic assemblies. Design/methodology/approach The key issue for this method is the low cohesive force of conformal coatings, and hence...

... joints challenging and new methods, such as adhesive attachments, have been developed. The applicability of these methods depends crucially on their long‐term reliability. Typical failures mechanisms in adhesive connection include cracking, open joints and delamination. Moisture is the principal cause...

... on the properties such as warpage of LTCC associated with conductors, microstructure of the fired thick films, sheet resistance and adhesion on LTCC. Design/methodology/approach Silver thick film paste compositions were formulated by changing the silver glass frit ratio. The compatibility of these formulated...

.... Design/methodology/approach In the work presented in this paper, the curing degree of an ACF at different bonding temperatures was measured using a differential scanning calorimeter. The adhesion strength and the contact resistance of ACF bonded chip‐on‐flex assembly were measured before and after...

... on an FR4 with solder mask substrate. Three properties of the underfill encapsulant that can affect the mechanical reliability of the die and substrate assembly are: CTE; elastic modulus; and adhesion to the die and substrate surfaces. The approach taken in this paper is to add silane coupling agents...