... and reliability. Optical microscopy or scanning electron microscopy micrographs are traditionally used for analysing the type and thickness of these compounds. An alternative analytical approach is presented. By using scanning electron microscopy in conjunction with energy‐dispersive X‐ray analysis, the elemental...

...John H. Lau; Chris Chang Most of the electronics packaging materials, especially solders, are temperature dependent. Their temperature‐dependent material properties can be obtained by TMA (thermal mechanical analysis), DMA (dynamic mechanical analysis), DSC (differential scanning calorimetry...