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Keywords: Analysis of failure processes
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 377–385.
Published: 10 June 2025
... within the material, increasing the likelihood of crack propagation along the grain boundaries. Lead-free solder joints Random vibration Intermetallic compounds Analysis of failure processes The development of electronic packaging technology has led to the Ball Grid Array (BGA) package...
