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Keywords: Analysis of failure processes
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Journal Articles
Analysis of micromorphological evolution of lead-free solder joints under random vibration
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 377–385.
Published: 10 June 2025
... the testing accuracy requirements and ensures the reliability and precision of the experimental data. Lead-free solder joints Random vibration Intermetallic compounds Analysis of failure processes In their study of the recent development of microelectronic packaging technology, Xiao et al...
