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Keywords: Ar-H2 plasmas
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2018) 30 (1): 42–48.
Published: 18 December 2017
...Yung-Sen Lin; Shiau-Min Lin; Jian-Yi Li; Min-Chih Liao Purpose An investigation has been performed on the improved solder wettability of oxidized aluminum (Al) with lead-free solder (96.5Sn-3.5Ag) using Ar-H2 plasmas. The lead-free solder wettability was raised from 62.2 per cent...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (3): 183–190.
Published: 22 June 2012
...Y.S. Lin; W.J. Lin; L.Y. Chiu Purpose The purpose of this paper is to investigate the effects of H2 flow rate on improving the solder wettability of oxidized‐copper with liquid lead‐free solder (96.5Sn‐3Ag‐0.5Cu) by Ar‐H2 plasmas. The aim was to improve the solder wettability of oxidized copper...
