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Keywords: Au–Ag alloy bump
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–8.
Published: 22 January 2026
...Bo-Wen Cai; Jia-Qi Wang; Qi Zhang; Li-Yin Gao; Changyou Ren; Zhi-Quan Liu Purpose This paper aims to systematically investigate the interfacial bonding behavior and high-temperature reliability of Au–Ag alloy bumps with different Au contents (20%, 40% and 100%) against a TiW adhesion layer...
