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Keywords: AuSn solder
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2025) 37 (5): 333–341.
Published: 03 July 2025
... promotes fast diffusion of AuSn solder into the grain boundary in Ni layer. It is found the solution of Cu in Ni layer also accelerates AuSn diffusion. As AuSn passed Ni layer and reached the WCu side, it tended to accumulate within the NiW rich region, forming an Au-Sn-Ni-W solid solution. Ni provides...
