...Mohammad A. Gharaibeh; James M. Pitarresi Purpose Because of growing demand for slim, thin and cheap handheld devices, reduced-volume solder interconnects like land grid array (LGA) are becoming attractive and popular choices over the traditional ball grid array (BGA) packages. This study aims...

... of the ball grid array (BGA) solders in the electronic kit under dynamic and vibration loads has been examined in Cinar and Jang (2014) and a high–low scale modeling was used to determine the stress intensity of the solder joints. A new fatigue equation with vibration frequency and cracking energy density...

... Emerald Publishing Limited Licensed re-use rights only Solder joints Thermal fatigue Reliability Ball grid array (BGA) The efficiency improvement of electronic packages is the main issue to fabricate reliable electronic systems applied in various industries. Therefore, a wide-ranging...

...Mohammad Gharaibeh; Aaron J. Stewart; Quang T. Su; James M. Pitarresi Purpose This paper aims to investigate and compare the reliability performance of land grid array (LGA) and ball grid array (BGA) solders, as well as the SAC105 and 63Sn37Pb solder alloys, in vibration loading conditions...

... 2018 Emerald Publishing Limited Licensed re-use rights only Reliability Analysis of variance (ANOVA) Ball grid array (BGA) Analytical solution During shipping, handling and service life, electronic devices are prone to vibration loadings, which might result in solder joint failures...

... of ball-grid array (BGA). Design/methodology/approach With the development of various sizes of BGA packages, the scaling effect of BGA model on capillary underfill (CUF) process is investigated together with the influences of different industrial standard solder bump arrangements and dispensing...