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Keywords: Ball grid array assembly
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (2): 77–91.
Published: 06 April 2012
... mechanism analysis. These methods involve a large number of experiments which are not cost effective. Flow Soldering Convection Forced convection reflow Computational fluid dynamics Finite element method Thermal coupling method Ball grid array assembly A=Heated area of the PCB...
