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Keywords: Bond parameter
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Journal Articles
Developing a model for the bond heel lifetime prediction of thick aluminium wire bonds
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2012) 24 (2): 127–134.
Published: 06 April 2012
... element method Bond parameter Material properties Nanoindentation Electronic control devices are exposed to large thermal and mechanical loads during operation. With regards to faster development cycles, electronic packaging and interconnection technology must be designed taking...
