... dispensing presents big limitations in terms of cost and processability. The purpose of this paper is to describe the way in which wafer‐level underfill (WLUF) process development was carried out with particular emphasis on microbump height coplanarity, bonding pressure distribution and the alignment...

...‐plated Cu inner leads. Therefore, it is essential that an appropriate bonding temperature is achieved during the inner lead bonding (ILB) process. The purpose of this paper is to identify the optimal processing conditions which maximize the reliability of the Au‐Sn joints. Design/methodology/approach...

... is to introduce a new experimental method for studying co‐planarity variation effects on ACA assemblies. Design/methodology/approach The approach simulates non‐planarity through deliberate chip rotation during the ACA bonding process, thereby locking different levels of co‐planarity variation into ACA test...

...Kyoo‐Seok Kim; Jae‐Pil Jung; Y. Norman Zhou Purpose The aim of the paper is to study the feasibility of direct ultrasonic bonding between contact pad arrays on flexible printed circuit boards (FPCB) and rigid printed circuit boards (RPCB) at ambient temperature. Design/methodology/approach...

... reflow temperatures of around 240 ∼ 250°C used with Pb‐free solders. During heating, Bi in the plated layer diffuses into the Sn‐3.5Ag core solder resulting in a transient decrease in soldering temperature based on the concept of transient liquid phase bonding. Findings The joints made with the Sn...

...K.K. Lee; N.H. Yeung; Y.C. Chan Purpose Anisotropic conductive adhesive film (ACF) is used for very fine pitch applications in the microelectronics industry, such as flip chip (FC) technology. During the bonding process, bumps on the chip and pads on the substrate are first aligned and then heat...

...Zhaowei Zhong The stud bump bonding (SBB) process was evaluated for a flip chip in package application. An SBB packaging process, having a reduced number of process steps compared with the typical SBB process, was proposed. The two separate steps of curing of conductive adhesive and underfill epoxy...

... Bonding Soldering Flip chip Fluxless The growing interest in flip‐chip technology for low‐cost applications on polymer substrates has led to a search for new processes and metallurgies. Flip‐chip assembly on printed wiring boards using surface laminate circuits (SLGs) with eutectic Sn/Pb...