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Keywords: COMSOL
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (1): 33–41.
Published: 25 June 2019
... and thick film. COMSOL software is used for finite element method (FEM) simulation of the LTCC hotplate structure. Findings Thermal reliability of these interconnections is tested by continuous operation of hotplate at 350°C for 175 h and cycling durability test performed at 500°C. Additionally...
