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Keywords: Capillary flow
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Journal Articles
Surface energetic-based analytical filling time model for flip-chip underfill process
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2021) 33 (5): 281–290.
Published: 20 May 2021
... be contacted at: aizatabas@usm.my 02 10 2020 16 11 2020 01 03 2021 04 03 2021 © Emerald Publishing Limited 2021 Emerald Publishing Limited Licensed re-use rights only Electronic packaging Underfill encapsulation Analytical filling time model Capillary flow Flip-chip...
Journal Articles
Influence of PTH offset angle in wave soldering with thermal-coupling method
Available to Purchase
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2014) 26 (3): 97–109.
Published: 27 May 2014
... – This study provides fundamental guidelines and references for the thermal coupling method to address reliability issues during wave soldering. It also enhances understanding of capillary flow and PTH joint issues to achieve high reliability in PCB assembly industries. The motion of the molten solder fluid...
