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Keywords: Capillary underfill encapsulation
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2020) 32 (3): 147–156.
Published: 04 February 2020
... Flip-chips Lattice Boltzmann method BGA packaging Capillary underfill encapsulation Ball grid array LBM Fundamental Research Grant Scheme (FRGS) 203/PMEKANIK/6071428 Research University (RU) 8014071 In surface mount technology (SMT), small, intricate electronic components...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2017) 29 (4): 173–190.
Published: 04 September 2017
... Limited 2017 Emerald Publishing Limited Licensed re-use rights only Ball grid array (BGA) Capillary contact angle Capillary underfill encapsulation Gap height Leverett-J function Scaling effect In electronic packaging, capillary underfill (CUF) has been proven to increase...
