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1-4 of 4
Keywords: Ceramics
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2011) 23 (4): 224–228.
Published: 20 September 2011
...Roman Koleňák; Michal Chachula; Pavol Šebo; Monika Koleňáková Purpose The purpose of this paper is to investigate the wettability of an active Sn2Ti solder on an Al2O3 ceramic material at temperatures of 700°C and higher. Based on the results of the wettability study...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2010) 22 (2): 21–29.
Published: 13 April 2010
...Olli Nousiainen; Timo Urhonen; Tero Kangasvieri; Risto Rautioaho; Jouko Vähäkangas Purpose The purpose of this paper is to investigate the feasibility of using land grid array (LGA) solder joints as a second-level interconnection option in low-temperature co-fired ceramic (LTCC)/printed wiring...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2009) 21 (2): 24–27.
Published: 10 April 2009
.... This leads to a higher energy‐ and interconnect‐density. Two challenges related to this request, that the industry is facing, are thermal management and reliability. This paper aim to discuss some aspects of using flip chip (FC) technology on low temperature cofired ceramics (LTCC) for this kind of products...
Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology (2005) 17 (3): 32–42.
Published: 01 September 2005
...Olli Nousiaianen; Risto Rautioaho; Kari Kautio; Jussi Jääskeläinen; Seppo Leppävuori Purpose To investigate the effect of the metallization and solder mask materials on the solder joint reliability of low temperature co‐fired ceramic (LTCC) modules. Design/methodology/approach The fatigue...
