... Emerald Group Publishing Limited 2009 Soldering Heating Circuit boards One of the most promising technologies of the first‐level and second‐level interconnection in electronic packaging is area array packaging, which requires soldering processing for connecting the chip and board (Wong...

...Goro Izuta; Tsuyoshi Tanabe; Katsuaki Suganuma Purpose The paper's purpose is to provide a solution to a problem on dissolution and disappearance of copper electrodes in solder bath in lead free soldering on printed circuit board (PCB). Design/methodology/approach The influence of the copper...