... of the samples, which typically corresponds to the separation of the BGA solder balls from the printed circuit boards. It can be seen from the graph that there was a general decrease in bending strength with increase in the number of reworks performed, with the most significant drop after a second rework. After...

... to influence the solder ball mechanical strength, as well as the bonding strength of the solder joints to the metallic substrates. © Emerald Group Publishing Limited 2007 Soldering Product reliability Circuits Shear strength Intermetallic formation and kinetics at the solid‐liquid...