.../approach A thermal‐coupling method that adopted the Multi‐physics Code Coupling Interface (MpCCI) was utilized. A forced‐convection reflow oven was modelled using computational fluid dynamic software (FLUENT 6.3.26), whereas structural heating at the board level was conducted using finite‐element...

...Chun‐Sean Lau; M.Z. Abdullah; F. Che Ani Purpose The purpose of this paper is to develop a thermal coupling method of a ball grid array (BGA) assembly during a forced convection reflow soldering process. Design/methodology/approach The reflow oven was modeled in computational fluid dynamic...

... the metal surfaces of oxides. This paper reports on attempts to model the physical and chemical processes occurring during solder paste reflow using computational fluid dynamics (CRD). Axisymmetric, 2 dimensional and 3‐dimensional models are described, and a method of reproducing oxide‐like behaviour...

... of the steady state flow‐field inside a reflow oven, which will be needed in subsequent transient analysis and small‐scale modelling. The model is constructed by utilising the advanced computational fluid dynamics (CFD) technology using commercial software. The computational results are discussed and compared...