... properties of Sn-(3-x)Ag-0.5Cu-xBi lead-free solder alloy systems were investigated and observed that increasing the addition of Bi (up to 1 per cent) to SAC305 solder alloy resulted with the low contact angles. The lowest θ was obtained as 35.34° for SAC-1Bi alloy at 310°C. Micro-structures...

... The melting characteristic of the lead-free alloys was studied using differential scanning calorimetry. Wettability was examined using wetting balance test for two liquid fluxes, water based and alcohol based in two temperatures 265°C and 277°C. Also, contact angle was measured using sessile drop test...

... cleaning treatments among other: argon glow discharge, dipping into alkaline solution at 60°C as well as washing in an ultrasonic bath of acetone and ethyl alcohol in room temperature. The relation between PEN foil morphology and surface properties has been studied by contact angle measurements as well...