...Krzysztof Jakub Stojek; Jan Felba; Johann Nicolics; Dominik Wołczyński Purpose This paper aims to develop thermal analysis method of thermal joints characterization. The impact on convection on thermal resistance analysis with use thermography for silver-based thermal joints were investigated...

...Chun‐Sean Lau; M.Z. Abdullah; F. Che Ani Purpose The purpose of this paper is to develop a thermal coupling method of a ball grid array (BGA) assembly during a forced convection reflow soldering process. Design/methodology/approach The reflow oven was modeled in computational fluid dynamic...