... of temperatures experienced by electronics during the wave soldering process is not sufficient for the removal of significant activator amounts. If the residues contain binary mixture of WOAs, the final ratio between the components, the residue level and the corrosive effects depend on the relative decomposition...

...Muhammad Firdaus Mohd Nazeri; Muhamad Zamri Yahaya; Ali Gursel; Fakhrozi Cheani; Mohamad Najmi Masri; Ahmad Azmin Mohamad Purpose The purpose of this paper is to review and examine three of the most common corrosion characterization techniques specifically on Sn-Zn solders. The discussion...

... at: kampio@mek.dtu.dk 23 01 2017 24 02 2017 17 03 2017 © Emerald Publishing Limited 2017 Emerald Publishing Limited Licensed re-use rights only Corrosion Flux Quality control Flux chemistry Climatic reliability of electronics Thermal decomposition...

...Vadimas Verdingovas; Morten Stendahl Jellesen; Rajan Ambat Purpose – This paper aims to investigate the effect of no-clean flux chemistry with various weak organic acids (WOAs) as activators on the corrosion reliability of electronics with emphasis on the hygroscopic nature of the residue...

...C. Ramirez; K.‐S. Lei The reliability and corrosivity of two VOC ‐ free, no‐clean fluxes (C and D) were assessed using traditional test method such as copper mirror and copper corrosion tests. Modified surface insulation resistance (SIR) tests using coupons fluxed with various methods were...