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Keywords: Cu-Cu direct bonding
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Journal Articles
Journal:
Soldering & Surface Mount Technology
Soldering & Surface Mount Technology 1–7.
Published: 20 January 2026
...Zehao Zhao; Wei Wu; Li-Yin Gao; Zhi-Quan Liu Purpose This study aims to address the high-temperature bottleneck of Cu-Cu direct bonding in three dimensional (3D) heterogeneous integration (3D HI) by proposing a synergistic regulation strategy involving (111) preferred orientation nanotwinned...
